Flexible organic light emitting diode display device

ABSTRACT

There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/360,578 filed on Nov. 23, 2016, which is a continuation of U.S.patent application Ser. No. 14/579,581 filed on Dec. 22, 2014, which areincorporated by reference herein in their entirety.

BACKGROUND Technical Field

This relates generally to electronic devices, and more particularly, toelectronic devices with a display.

Description of the Related Art

Electronic devices often include displays. For example, cellulartelephones and portable computers include displays for presentinginformation to a user. Components for the electronic device, includingbut not limited to a display, may be mounted in a plastic or a metalhousing.

An assembled display may include a display panel and a number ofcomponents for providing a variety of functionalities. For instance, oneor more display driving circuits for controlling the display panel maybe included in a display assembly. Examples of the driving circuitsinclude gate drivers, emission (source) drivers, power (VDD) routing,electrostatic discharge (ESD) circuits, multiplex (mux) circuits, datasignal lines, cathode contacts, and other functional elements. There maybe a number of peripheral circuits included in the display assembly forproviding various kinds of extra functions, such as touch sense orfingerprint identification functionalities. Some of the components maybe disposed on the display panel itself, often in the periphery areasnext to the display area, which is referred in the present disclosure asthe non-display area and/or the non-display area.

Size and weight are of the critical importance in designing modernelectronic devices. Also, a high ratio of the display area size comparedto that of non-display area, which is sometimes referred to as thescreen to bezel ratio, is one of the most desired feature. However,placing some of the aforementioned components in a display assembly mayrequire large non-display area, which may add up to a significantportion of the display panel. Large non-display area tends to make thedisplay panel bulky, making it difficult to incorporate it into thehousing of electronic devices. Large non-display area may alsonecessitate a large masking (e.g., bezel, borders, covering material) tocover a significant portion of the display panel, leading to unappealingdevice aesthetics.

Some of the components can be placed on a separate flexible printedcircuit film and positioned on the rear side of the display panel. Evenwith such a configuration, however, the interfaces for connecting theflexible printed circuit and the wires between the display area and theconnection interface still limit how much reduction in the size of thenon-display area can be realized by placing components on a separateFPC.

BRIEF SUMMARY

Accordingly, it is desirable to bend the base substrate where thedisplay area and the non-display area are formed thereon. This wouldallow even some of the non-display area to be positioned behind thedisplay area of the display panel, thereby reducing or eliminating thenon-display area that needs to be hidden under the masking or the devicehousing. Not only does the bending of the base substrate will minimizethe non-display area size need to be hidden from view, but it will alsoopen possibility to various new display device designs.

An aspect of the present disclosure is related to a flexible displayprovided with printed circuit board. The flexible display includes aflexible base layer defined with a first area, a second area and a bendallowance section between the first area and the second area of theflexible base layer. In the first area of the flexible base layer, anarray of thin-film transistors and an array of organic-light emittingdiode (OLED) elements disposed. The array of thin-film transistors isconfigured to control emission of the array of OLED elements. In thesecond area of the flexible base layer, at least one driver integratedcircuit is disposed in the second area of the flexible display. Theflexible display further includes a flexible printed circuit boardconnected to a connection interface provided in the second area of theflexible base layer. In addition to the driver integrated circuit in thesecond area, a gate driver circuitry, for instance gate-in-panel, isprovided in the first area of the flexible base layer.

In some embodiments, the D-IC disposed on the flexible base layer may bea display D-IC. The flexible printed circuit board includes a pluralityof conductive lines in the bend allowance section, which are routed fromthe D-IC in the second area of the flexible base layer to one or moreconductive lines placed in the first area of the flexible display.

In some embodiments, at least two conductive lines in the first metallayer of the flexible printed circuit board are bridged by at least oneof the conductive lines in the second metal layer of the flexibleprinted circuit board.

Further features of the invention, its nature and various advantageswill be more apparent from the accompanying drawings and the followingdetailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a schematic view of an exemplary flexible displayaccording to embodiments of the present disclosure.

FIG. 1B illustrates an enlarged view of a part of the bend allowancesection of an exemplary flexible display at according to embodiments ofthe present disclosure.

FIG. 2 illustrates a schematic view of an exemplary flexible displayaccording to embodiments of the present disclosure.

FIGS. 3A and 3B illustrate exemplary arrangement of display areas in aflexible display according to embodiments of the present disclosure.

FIG. 4 illustrates simplified stack-up structure of components in anexemplary flexible display apparatus according to embodiment of thepresent disclosure.

FIGS. 5A-5D are cross-sectional views of illustrative arrangement ofcomponents in a flexible display apparatus according to variousembodiments of the present disclosure.

FIG. 6A illustrates exemplary arrangement of bridged conductive lines ina non-display area with a bend allowance section according toembodiments of the present disclosure.

FIG. 6B illustrates exemplary arrangement of bridged conductive lines ina non-display area without a bend allowance section according toembodiments of the present disclosure.

FIGS. 7A and 7B each illustrates a cross-sectional view of an exemplaryconfiguration of bridged conductive lines according to embodiments ofthe present disclosure.

FIGS. 8A and 8B illustrate a schematic view of exemplary strain-reducingwire trace designs having a plurality of sub-traces that split and mergeat a certain interval according to embodiments of the presentdisclosure.

FIG. 8C illustrates an exemplary arrangement of the wire tracesincluding indented sections and distended sections.

FIGS. 9A-9C illustrate schematic views of the flexible display providedwith a micro-coating layer according to embodiments of the presentdisclosure.

FIGS. 10A and 10B illustrate schematic views of embodiments of theflexible display in a bent state, which are provided with amicro-coating layer according to embodiments of the present disclosure.

FIG. 11 illustrates a schematic view of an exemplary strain-reducingwire trace design provided with elongated channel(s) for improvingspread dynamics of a micro-coating layer.

FIG. 12 illustrates schematic view of a flex on panel (FOP) area where aprinted circuit board is attached to a base layer if the flexibledisplay according to an embodiment of the present disclosure.

FIGS. 13A-13D each illustrates a schematic cross-sectional view of anexemplary printed circuit board, which may be employed in variousembodiments of the flexible display.

FIGS. 14A-14D are plan views illustrating exemplary configurations ofthe connectors on the first printed circuit in the FOP area.

DETAILED DESCRIPTION

Flexible Display

FIGS. 1A and 1B illustrate exemplary embodiment of a flexible displaywhich may be incorporated in electronic devices. The flexible display100 includes at least one display area (i.e., Active Area), in which anarray of display pixels are formed therein.

One or more non-display areas may be provided at the periphery of thedisplay area. That is, the non-display area may be adjacent to one ormore sides of the display area. In FIGS. 1 and 2, the non-display areasurrounds a rectangular shape display area. However, it should beappreciated that the shapes of the display area and the arrangement ofthe non-display area adjacent to the display area are not particularlylimited as the exemplary flexible display 100 illustrated in FIGS. 1Aand 1B. The display area and the non-display area may be in any shapesuitable to the design of the electronic device employing the flexibledisplay 100. Non-limiting examples of the display area shapes in theflexible display 100 include a pentagonal shape, a hexagonal shape, acircular shape, an oval shape, and more.

Each display pixel PX may include a light-emitting element, for instancean organic light-emitting diode (OLED), and pixel circuit. Each displaypixel in the display area may be associated with a pixel circuit, whichincludes at least one switching thin-film transistor (TFT) and at leastone driving TFT on the backplane of the flexible display 100. Each pixelcircuit may be electrically connected to a gate line and a data line tocommunicate with one or more driving circuits, such as a gate driver anda data driver positioned in the non-display area of the flexible display100.

For example, one or more driving circuits may be implemented with TFTsfabricated in the non-display area. Such a driving circuit may bereferred to as a gate-in-panel (GIP). The flexible display 100 mayinclude various additional components for generating a variety ofsignals for operating the pixels in the display area. Non limitingexamples of the components for operating the pixels include a displaydriver integrated circuit (D-IC) 230, an inverter circuit, amultiplexer, an electro static discharge (ESD) circuit, a power supplyunit and the like.

The flexible display 100 may also include components associated withfunctionalities other than for operating the pixels of the flexibledisplay 100. For instance, the flexible display 100 may includecomponents for providing a touch sensing functionality, a userauthentication functionality (e.g., finger print scan), a multi-levelpressure sensing functionality, a tactile feedback functionality and/orvarious other functionalities for the electronic device employing theflexible display 100.

Some of the aforementioned components may be mounted directly on thebase layer 106. For instance, the driver-IC (D-IC) 230 can be disposeddirectly on the base layer 106. The COMP_A 230 may be a display driverIC, a touch driver IC, or various other integrated circuit chips thatcan be placed on a flexible polymer layer. In the flexible display ofthe present disclosure, an array of pixel circuits and an array ofdisplay pixels are formed on a flexible polymer layer (e.g., polyimidelayer). Accordingly, any components of the flexible display 100 or anycomponents used by the electronic device employing the flexible display100, can also be placed directly on the base layer 106 so long as it canbe formed on the flexible polymer layer (e.g., PI layer). Componentsthat can go on to the base layer 106 include integrated circuits such asa microprocessor, a microcontroller, an audio chip, anapplication-specific integrated circuit, or other integrated circuit.Also, discrete electrical components (e.g., resistors, inductors,capacitors, and transistors) may also be mounted directly on the baselayer 106.

FIG. 1B is an enlarged view of an exemplary interconnects between theCOMP_A 230 on the base layer 106 and the display pixels in the displayarea. As shown in FIG. 1B, the wire traces applied with astrain-reducing trace pattern laid across the bend allowance section ofthe flexible display 100 can be connected directly to the COMP_A 230. Inthis way, spaces for providing connection interfaces to connect anotherdiscrete printed circuit can be eliminated from the base layer 106. Inaddition to the extra area realized from eliminating connectioninterfaces, placing the components of the flexible display 100 directlyon the base layer 106 can simplify the manufacturing processes, as theprocesses for making connection interfaces on the base layer 106 andbonding the base layer 106 and the separate printed circuit are nolonger necessary. Further, the direct connection between the componentsof the flexible display 100 on the base layer 106 can make the flexibledisplay 100 to be more efficient, may consume less power, may be morereliable, and may enable desirable design features.

Any components of the flexible display 100, which cannot be placeddirectly on the base layer 106 may be mounted on a separate printedcircuit board 200 and coupled to a connection interface (e.g., pads,bumps, pins, etc.) disposed in the non-display.

As will be described in further detail below, the non-display area withthe connection interface can be bent away from the plane of the adjacentportion of the flexible display so that the printed circuit board 200 ispositioned at the rear side of the flexible display 100.

Multiple parts of the flexible display 100 can be bent along the bendline BL. The bend line BL in the flexible display 100 may be orientedhorizontally (e.g., X-axis shown in FIG. 2), vertically (e.g., Y-axisshown in FIG. 2) or even diagonally. Accordingly, the flexible display100 can be bent in any combination of horizontal, vertical and/ordiagonal directions based on the desired design of the flexible display100.

In some embodiments, one or more edges of the flexible display 100 canbe bent away from the plane of the central portion along the bend lineBL. In FIG. 2, the bend line BL is depicted as being located near theedges of the flexible display 100. However, it should be noted that thebend lines BL can extend across the central portion or extend diagonallyat one or more corners of the flexible display 100. Such configurationswould allow the flexible display 100 to provide a display area at anedge of the display device or a foldable display with display pixelsprovided on both inner/outer sides of in folded configuration.

With the ability to bend one or more portions of the flexible display100, part of the flexible display 100 may be defined as a substantiallyflat portion and a bend portion. A part of the flexible display 100 mayremain substantially flat and referred to as a substantially flatportion of the flexible display 100. A part of the flexible display 100may be bent in a certain bend angle from the plane of an adjacentportion, and such portion is referred to as a bend portion of theflexible display 100. The bend portion includes a bend allowancesection, which can be actively curved in a certain bend radius.

For easier bending of the base layer 106, the base layer 106 near thebend allowance section may be chamfered. In this case, the width of thebase layer 106 at the bend allowance section will be lower than thewidth of the adjacent areas of the base layer 106. Further, the baselayer 106 may be thinner in the bend allowance section than the adjacentareas of the base layer 106.

Depending on the location of the bend line BL in the flexible display100, a portion on one side of the bend line may be positioned toward thecenter of the flexible display 100, whereas the portion on the oppositeside of the bend line BL is positioned toward an edge portion of theflexible display 100. The portion toward the center may be referred toas the central portion and the portion toward the edge may be referredto as the edge portion of the flexible display 100. Although this maynot always be the case, a central portion of the flexible display 100can be the substantially flat portion and the edge portion can be thebend portion of the flexible display 100. It should be noted that asubstantially flat portion can also be provided in the edge portion ofthe flexible display 100. Further, in some configuration of the flexibledisplay 100, a bend allowance section may be positioned between twosubstantially flat portions.

It should be understood that the term “substantially flat” includes aportion that may not be perfectly flat. As such, a central portion ofthe flexible display 100 provided with a slightly concave or convexcontour may still be referred as a substantially flat portion in someembodiments discussed in the present disclosure. Even when the“substantially flat” portion has a concave or convex contour, one ormore bend portions positioned at the periphery of the convex or concavecentral portion are bent inwardly or outwardly along the bend line in abend angle about a bend axis. The bend radius of the bend portion issmaller than the bend radius of the central portion. In short, the term“substantially flat portion” is used in the present disclosure to refera portion with a lesser curvature than that of an adjacent bendallowance section of the flexible display 100.

The location of the display area is not limited to the central portionor to the substantially flat portion of the flexible display 100. Insome embodiments, the bend portion of the flexible display 100 mayinclude a display area capable of displaying image from the bendportion, which is referred herein after as the secondary display area.That is, the bend line BL can be positioned in the display area so thatat least some display pixels of the display area is included in the bendportion of the flexible display 100.

FIGS. 3A and 3B each illustrates an exemplary configuration of displayareas in an embodiment of flexible display 100 of the presentdisclosure. In the configuration depicted in FIG. 3A, the matrix ofpixels in the secondary display area of the bend portion may becontinuously extended from the matrix of the pixels in the display areaof the central portion. Alternatively, in the configuration depicted inFIG. 3B, the secondary display area within the bend portion and thedisplay area within the central portion of the flexible display 100 maybe separated apart from each other by a space in the bend allowancesection of the flexible display 100. Some components in the centralportion and the bend portion can be electrically connected via one ormore conductive lines 120 laid across the bend allowance section of theflexible display 100.

The pixels in the secondary display area and the pixels in the centraldisplay area may be addressed by the driving circuits (e.g., gatedriver, data driver, etc.) as if they are in a single matrix. In thiscase, the pixels of the central display area and the pixels of thesecondary display area may be operated by the same set of drivingcircuits. By way of example, the N^(th) row pixels of the centraldisplay area and the N^(th) row pixels of the secondary display area maybe configured to receive the gate/data signals from the same displaydriver IC. As shown in FIG. 3B, the part of the conductive line crossingover the bend allowance section may have a strain-reducing trace design,which will be described in further detail below.

Depending on the functionality of the secondary display area, the pixelsof the secondary display area can be driven discretely from the pixelsin the central display area. That is, the pixels of the secondarydisplay area may be recognized by the display driving circuits as beingan independent matrix of pixels separate from the matrix of pixels ofthe central display area. In such cases, the pixels of the secondarydisplay area may receive signals from at least one discrete drivingcircuit other than a driving circuit for providing signals to the pixelsof the central display area.

Regardless of the configuration, the secondary display area in the bendportion may serve as a secondary display area in the flexible display100. Also, the size of the secondary display area is not particularlylimited. The size of the secondary display area may depend on itsfunctionality within the electronic device. For instance, the secondarydisplay area may be used to provide images and/or texts such a graphicaluser interface, buttons, text messages, and the like. In some cases, thesecondary display area may be used to provide light of various colorsfor various purposes (e.g., status indication light), and thus, the sizeof the secondary display area need not be as large as the display areain the central portion of the flexible display 100.

Stack-Up Structure

FIG. 4 is a simplified cross-sectional view showing an exemplary stackup structure of a flexible display 100 in an embodiment of the presentdisclosure. For convenience of explanation, the central portion of theflexible display 100 is illustrated as being substantially flat, and thebend portions are provided at the edges of the flexible display 100 inFIG. 4.

As shown, one or more bend portions may be bent away from the plane ofthe substantially flat portion in a certain bend angle θ and with a bendradius R about the bending axis. The size of each bend portion that isbent away from the central portion needs not be the same. That is, thelength of the base layer 106 from the bend line BL to the outer edge ofthe base layer 106 at each bend portion can be different from other bendportions. Also, the bend angle θ around the bend axis and the bendradius R from the bend axis can vary between the bend portions.

In the example shown in FIG. 4, the right side bend portion has the bendangle θ of 90°, and the bend portion includes a substantially flatsection. A bend portion can be bent at a larger bend angle θ, such thatat least some part of the bend portion comes underneath the plane of thecentral portion of the flexible display 100 as the bend portion on theleft side of the flexible display 100. Also, a bend portion can be bentat a bend angle θ that is less than 90°.

In some embodiments, the radius of curvatures (i.e., bend radius) forthe bend portions in the flexible display 100 may be between about 0.1mm to about 10 mm, more preferably between about 0.1 mm to about 5 mm,more preferably between about 0.1 mm to about 1 mm, more preferablybetween about 0.1 mm to about 0.5 mm. In some embodiments, the bendradius at a bend portion of the flexible display 100 may be less than0.5 mm.

One or more support layers 108 may be provided at the underside of thebase layer 106 to increase rigidity and/or ruggedness at the selectiveportion of the flexible display 100. For instance, the support layer 108can be provided on the inner surface of the base layer 106 at thesubstantially flat portions of the flexible display 100. The supportlayer 108 may also be provided in the bend portion. If desired, somepart of the base layer 106 requiring more flexibility may not beprovided with the support layer 108. For instance, the support layer 108may not be provided in the bend allowance section of the flexibledisplay 100. In one suitable embodiment, the part of the base layer 106in the bend portion, which is positioned under the plane of the centralportion of the flexible display 100, can be provided with the supportlayer 108. Increased rigidity and ruggedness at selective parts of theflexible display 100 may help in ensuring accurate configuration andplacement of various components during manufacturing and using theflexible display 100.

The base layer 106 and the support layer 108 may each be made of a thinplastic film formed from polyimide, polyethylene naphthalate (PEN),polyethylene terephthalate (PET), other suitable polymers, a combinationof these polymers, etc. Other suitable materials that may be used toform the base layer 106 and the support layer 108 include, a thin glass,a metal foil covered with a dielectric material, a multi-layered polymerstack and a polymer composite film comprising a polymer materialcombined with nanoparticles or micro-particles dispersed therein, etc.Support layers 108 provided in various parts of the flexible display 100need not be made of the same material. For example, a thin-glass layermay be used as a support layer 108 for the central portion of theflexible display 100 while a thin plastic film layer is used as asupport layer 108 for edge portions.

In addition to the constituent material, the thickness of the base layer106 and the support layer 108 is another factor to consider in designingthe flexible display 100. On the one hand, bending of the base layer 106at a small bend radius can be difficult if the base layer 106 hasexcessively high thickness. Also, excessive thickness of the base layer106 can increase mechanical stress to the components disposed thereonduring bending the base layer 106. On the other hand, however, the baselayer 106 can be too fragile to serve as a substrate for variouscomponents of the flexible display if it is too thin.

To meet such requirements, the base layer 106 may have a thickness in arange of about from 5 μm to about 50 μm, more preferably in a range ofabout 5 μm to about 30 μm, and more preferably in a range of about 5 μmto about 16 μm. The support layer 108 may have a thickness from about100 μm to about 125 μm, from about 50 μm to about 150 μm, from about 75μm to 200 μm, less than 150 μm, or more than 100 μm.

In one suitable exemplary configuration, a layer of polyimide with athickness of about 10 μm to about 16 μm serves as the base layer 106while a polyethylene terephthalate (PET) layer with a thickness of about50 μm to about 125 μm serves as the support layer 108. In anothersuitable exemplary configuration, a layer of polyimide with a thicknessof about 10 μm to about 16 μm serves as the base layer 106 while athin-glass layer with a thickness of about 50 μm to about 200 μm is usedas the support layer 108. In yet another suitable exemplaryconfiguration, a thin glass layer is used as the base layer 106 with alayer of polyimide serving as the support layer 108 to suppress breakingof the base layer 106.

During manufacturing, some part of the flexible display 100 may beexposed to external light. Some materials used in fabricating thecomponents on the base layer 106 or the components themselves mayundergo undesirable state changes (e.g., threshold voltage shift in theTFTs) due to the light exposure during the manufacturing of the flexibledisplay 100. Some parts of the flexible display 100 may be more heavilyexposed to the external light than others, and this can lead to adisplay non-uniformity (e.g., mura, shadow defects, etc.). To minimizesuch problems, the base layer 106 and/or the support layer 108 mayinclude one or more materials capable of reducing the amount of externallight passing through in some embodiments of the flexible display 100.

The light blocking material, for instance chloride modified carbonblack, may be mixed in the constituent material of the base layer 106(e.g., polyimide or other polymers). In this way, the base layer 106 mayformed of polyimide with a shade to provide a light blockingfunctionality. Such a shaded base layer 106 can also improve thevisibility of the image content displayed on the flexible display 100 byreducing the reflection of the external light coming in from the frontside of the flexible display 100.

Instead of the base layer 106, the support layer 108 may include a lightblocking material to reduce the amount of light coming in from the rearside (i.e., the support layer 108 attached side) of the flexible display100. The constituent material of the support layer 108 may be mixed withone or more light blocking materials in the similar fashion as describedabove with the base layer 106. Further, both the base layer 106 and thesupport layer 108 can include one or more light blocking materials.Here, the light blocking materials used in the base layer 106 and thesupport layer 108 need not be the same.

Backplane of the flexible display 100, including the array of pixelcircuits, is implemented on the base layer 106. Thin-film transistorsused in implementing the backplane of the flexible display 100 may use alow-temperature poly-silicon (LTPS) semiconductor layer or use an oxidesemiconductor layer. In some embodiments, the flexible display 100 mayemploy multiple kinds of TFTs to implement the driving circuits in thenon-display area and/or the pixel circuits in the display area. That is,a combination of an oxide semiconductor TFT and an LTPS TFT may be usedto implement the backplane of the flexible display 100. In thebackplane, the type of TFTs may be selected according to the operatingconditions and/or requirements of the TFTs within the correspondingcircuit.

The organic light-emitting diode (OLED) element layer 102 is provided onthe base layer 106. The OLED element layer 102 includes a plurality ofOLED elements, which is controlled by the pixel circuits and the drivingcircuits implemented on the base layer 106 as well as any other drivingcircuits connected to the connection interfaces on the base layer 106.The OLED element of the display pixel may emit light of certain spectralcolor (e.g., red, green, blue). In some embodiments, the OLED elementlayer 102 may include OLED elements configured to emit white light.

The encapsulation 104 is provided to protect the OLED element layer 102from gas and moisture. The encapsulation 104 may include multiple layersof materials for reducing permeation of gas and moisture to protect OLEDelements thereunder. In some embodiments, the encapsulation 104 may beprovided in a form of a thin film, which is sometimes called as “barrierfilm layer (BFL).”

The flexible display 100 may also include a polarization layer 110 forcontrolling the display characteristics (e.g., external lightreflection, color accuracy, luminance, etc.) of the flexible display100. Also, the cover layer 114 may be used to protect the flexibledisplay 100.

Electrodes for sensing touch input from a user may be integrated intothe one or the layers provided in the flexible display 100. Forinstance, the electrodes for sensing touch input from a user may beintegrated into the OLED element layer 102. The electrodes for sensingtouch input may be formed on an interior surface of a cover layer 114and/or at least one surface of the polarization layer 110. If desired,an independent layer with the touch sensor electrodes and/or othercomponents associated with sensing of touch input (referred hereinafteras touch-sensor layer 112) may be provided in the flexible display 100.The touch sensor electrodes (e.g., touch driving/sensing electrodes) maybe formed from transparent conductive material such as indium tin oxide,carbon based materials like graphene or carbon nanotube, a conductivepolymer, a hybrid material made of mixture of various conductive andnon-conductive materials. Also, metal mesh (e.g., aluminum mesh, silvermesh, etc.) can also be used as the touch sensor electrodes.

The touch sensor layer 112 may include a layer formed of one or moredeformable dielectric materials. One or more electrodes may beinterfaced with or positioned near the touch sensor layer 112, andloaded with one or more signals to facilitate measuring electricalchanges on one or more of the electrodes upon deformation of the touchsensor layer 112. The measurement may be analyzed to assess the amountof pressure at a plurality of discrete levels and/or ranges of levels onthe flexible display 100.

In some embodiments, the touch sensor electrodes can be utilized inidentifying the location of the user inputs as well as assessing thepressure of the user input. Identifying the location of touch input andmeasuring of the pressure of the touch input on the flexible display 100may be achieved by measuring changes in capacitance from the touchsensor electrodes on one side of the touch sensor layer 112. The touchsensor electrodes and/or other electrode may be used to measure a signalindicative of the pressure on the flexible display 100 by the touchinput. Such a signal may be obtained simultaneously with the touchsignal from the touch sensor electrodes or obtained at a differenttiming.

As mentioned above, bending the non-display area allows to minimize orto eliminate the non-display area to be seen from the front side of theassembled flexible display 100. Part of the non-display area thatremains visible from the front side can be covered with a bezel. Thebezel may be formed, for example, from a stand-alone bezel structurethat is mounted to the cover layer 114, a housing or other suitablecomponents of the flexible display 100. The non-display area remainingvisible from the front side may also be hidden under an opaque maskinglayer, such as black ink (e.g., a polymer filled with carbon black) or alayer of opaque metal. Such an opaque masking layer may be provided on aportion of various layers included in the flexible display 100, such asa touch sensor layer 112, a polarization layer 110, a cover layer 114,and other suitable layers included in the flexible display 100.

Components of the flexible display 100 may make it difficult to bend theflexible display 100 along the bend line BL. Some of the elements, suchas the support layer 108, the touch sensor layer 112, the polarizationlayer 110 and the like, may add too much rigidity to the flexibledisplay 100. Also, the thickness of such elements shifts the neutralplane of the flexible display 100 and thus some of the components may besubject to greater bend stresses than other components.

To facilitate easier bending and to enhance the reliability of theflexible display 100, the configuration of components in the bendportion of the flexible display 100 differs from the substantially flatportion of the flexible display 100. Some of the components existing inthe substantially flat portion may not be disposed in the bend portionsof the flexible display 100, or may be provided in a differentthickness. The bend portion may free of the support layer 108, thepolarization layer 110, the touch sensor layer 112, a color filter layer(not shown) and/or other components that may hinder bending of theflexible display 100. Such components may not be needed in the bendportion if the bend portion is to be hidden from the view or otherwiseinaccessible to the users of the flexible display 100.

Even if the secondary display area is in the bend portion for providinginformation to users, the secondary display area may not require some ofthese components depending on the usage and/or the type of informationprovided by the secondary display area. For example, the polarizationlayer 110 and/or color filter layer may not be needed in the bendportion when the secondary display area is used for simply emittingcolored light, displaying texts or simple graphical user interfaces in acontrast color combination (e.g., black colored texts or icons in whitebackground). Also, the bend portion of the flexible display 100 may befree of the touch sensor layer 114 if such functionality is not neededin the bend portion. If desired, the bend portion may be provided with atouch sensor layer 112 and/or the layer of electro-active material eventhough the secondary display area for displaying information is notprovided in the bend portion.

Since the bend allowance section is most heavily affected by the bendstress, various bend stress-reducing features are applied to thecomponents on the base layer 106 of the bend allowance section. To thisend, some of the elements in the central portion may be absent in atleast some part of the bend portion. The separation between thecomponents in the central portion and the bend portion may be created byselectively removing the elements at the bend allowance section of theflexible display 100 such that the bend allowance section is free of therespective elements.

As depicted in FIG. 4, the support layer 108 in the central portion andthe support layer 108 in the bend portion can be separated from eachother by the absence of the support layer 108 at the bend allowancesection. Instead of using the support layer 108 attached to the baselayer 106, a support member 116 with a rounded end portion can bepositioned underside of the base layer 106 at the bend allowancesection. Various other components, for example the polarization layer110 and the touch sensor layer 112 and more, may also be absent from thebend allowance section of the flexible display 100. The removal of theelements may be done by cutting, wet etching, dry etching, scribing andbreaking, or other suitable material removal methods. Rather thancutting or otherwise removing an element, separate pieces of the elementmay be formed at the selective portions (e.g., substantially flatportion and the bend portion) to keep the bend allowance section free ofsuch element.

As mentioned, the support layer 108 may not be present at the bendallowance section to facilitate easier bending of the base layer 106.Absent the support layer 108, however, the curvature at the bendallowance section may be easily altered by external force. To supportthe base layer 106 and maintain the minimum curvature at the bendallowance section, the flexible display 100 may also include a supportmember 116, which may also be referred to as a “mandrel.” The exemplarysupport member 116 depicted in FIG. 4 has an elongated body portion anda rounded end portion. The base layer 106 and the support member 116 arearranged so that that the rounded end portion of the support member 116is positioned at the underside of the base layer 106 corresponding tothe bend allowance section of the flexible display 100.

In embodiments where a bend portion is provided at an edge of theflexible display 100, the support member 116 can be provided at the edgeof the flexible display 100. In this setting, a part of the base layer106 may come around the rounded end portion of the support member 116and be positioned at the underside the support member 116 as depicted inFIG. 4. Various circuits and components in the non-display area of theflexible display 100, such as driving circuits and interfaces forconnecting printed circuit boards (PCB) may be provided on the baselayer 106 that is positioned at the rear side of the flexible display100. In this way, even the components that are not flexible enough to bebent in a bend radius desired by the flexible display 100 can be placedunder the display area of the flexible display 100.

The support member 116 can be formed of plastic material such aspolycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN),polyethylene terephthalate (PET), other suitable polymers, a combinationof these polymers, etc. The rigidity of the support member 116 formed ofsuch plastic materials may be controlled by the thickness of the supportmember 116 and/or by providing additives for increasing the rigidity.The support member 116 can be formed in a desired color (e.g., black,white, etc.). Further, the support member 116 may also be formed ofglass, ceramic, metal or other rigid materials or combinations ofaforementioned materials.

Size and shape of the rounded end portion of the support member 116 canvary depending on the minimum curvature desired at the bend allowancesection of the flexible display 100. In some embodiments, the thicknessof the rounded end portion and the thickness of the elongated bodyportion may be substantially the same. In other embodiments, theelongated body portion, which has a planar shape, may be thinner thanthe rounded end portion of the support member 116. With a thinnerprofile at the elongated body portion, the support member 116 cansupport the bend allowance section while avoiding unnecessary increasein the thickness in the flexible display 100.

Since the support at the bend allowance section is provided by therounded end portion of the support member 116, the elongated bodyportion in the substantially flat portion of the flexible display 100needs not be extended into the display area. While the elongated bodyportion can be extended under the display area for various reasons, thelength of the elongated body portion from the rounded end portiontowards the opposite end is sufficient so long as it provides enoughsurface area for securing the support member 116 in a desired locationof the flexible display 100.

To secure the support member 116 in the flexible display 100, anadhesive layer 118 may be provided on the surface of the support member116. The adhesive layer 118 may include a pressure-sensitive adhesive, afoam-type adhesive, a liquid adhesive, a light-cured adhesive or anyother suitable adhesive material. In some embodiments, the adhesivelayer 118 can be formed of, or otherwise includes, a compressiblematerial and serve as a cushion for the parts bonded by the adhesivelayer 118. As an example, the constituent material of the adhesive layer118 may be compressible. The adhesive layer 118 may be formed ofmultiple layers, which includes a cushion layer (e.g., polyolefin foam)interposed between an upper and a lower layers of an adhesive material.

The adhesive layer 118 can be placed on at least one of the uppersurface and the lower surface of the elongated body portion of thesupport member 116. When the bend portion of the flexible display 100wraps around the rounded end portion of the support layer 116, anadhesive layer 118 can be provided on both the lower surface (i.e., thesurface facing the rear side) and the upper surface (i.e., the surfacefacing the front side) of the elongated body portion. If desired, anadhesive layer 118 may be provided between the surface of the roundedend portion of the support member 116 and the inner surface of the baselayer 106.

During bending, a part of the flexible display 100 on one side of thesupport member 116 may be pulled toward the support member 116, and thebase layer 106 may be damaged by the highest and the lowest edges of therounded end portion. As such, the height of the adhesive layer 118 andthe support layer 108 between the support member 116 and the base layer106 may be at least equal to or greater than the vertical distancebetween the highest edge of the rounded end portion and the surface ofthe elongate body portion where the adhesive layer 118 is placed. Inother words, the height of the space created by the thickness differencebetween the rounded end portion and the elongated body portion of thesupport member 116 may be equal to or less than the collective thicknessof the support layer 108 and the adhesive layer 118.

Depending on the shape of the support member 116, a thickness of theadhesive layer 118 on the upper and the lower surfaces of the elongatedbody portion may be different. For instance, the elongated body portion,which is thinner than the rounded end portion, may not be at the centerof the rounded end portion of the support member 116. In such cases, thespace on one side of the support member 116 may be greater than thespace on the opposite side.

In another example, the lowest edge of the rounded end portion may bein-line with the bottom surface of the elongated body portion such thatthe space is provided only on one side of the elongated body portion. Insuch cases, the adhesive layer 118 on one side of the elongated bodyportion of the support member 116 can be thicker than the one on theopposite side. It should be appreciated that the dimensions of thesupport member 116 in FIG. 4 may be exaggerated for the purposes ofsimpler explanation.

FIGS. 5A, 5B, 5C and 5D are simplified cross-sectional views showingexemplary arrangements of elements in various embodiments of theflexible display 100. In one suitable configuration, which is depictedin FIG. 5A, the thickness of the rounded end portion and the elongatedbody portion of the support member 116A may be substantially the same asillustrated in FIG. 5A. Such a support member 116A can be formed of theplastic materials mentioned above. The support member 116A may also beformed of a folded thin sheet metal (e.g., SUS). In this case, thefolded edge of the sheet metal can serve as the rounded end portion ofthe support member 116A. Even when a sheet metal is used to form thesupport member, the rounded end portion can have greater thickness thanthe elongated body portion. For instance, pressure can be applied on thepart of the folded metal sheet for the elongated body portion to makethat portion thinner than the folded edge.

An adhesive layer 118A may be applied on the upper, the lower surfaceand the surface of the rounded end portion of the support member 116A.As the thickness of the support member 116A at the rounded end portionand the elongated body portion is about the same, the thickness of theadhesive layer 118A may have a substantially uniform thickness on thesurface of the support member 116A. However, it should be noted that theadhesive layer 118A can be thinner and/or thicker at selective parts ofthe support member 116A.

In another suitable configuration, which is depicted in FIG. 5B, theelongated body portion of the support member 116 is thinner than itsrounded end portion. In this regard, the bottom surface of the elongatedbody portion is in-line with the lowest edge of the rounded end portion,providing a support member 116B with a flat bottom. In this exemplaryconfiguration, the support members 116B may be formed of one or acombination of aforementioned plastic materials (e.g., polycarbonate).Also, the adhesive layer 118B provided on the upper surface of theelongated body portion is thicker than the adhesive layer 118B providedon the bottom surface of the elongated body portion of the supportmember 116B. The adhesive layer 118B on the upper surface of theelongated body portion may include a cushion layer described above whilethe adhesive layer 118B on the lower surface does not.

In yet another suitable configuration shown in FIG. 5C, neither the topnor the bottom surfaces of the elongated body portion of the supportmember 116C is in-line with the highest/lowest edges of the roundedportion. The support members 116C may be formed of one or a combinationof aforementioned plastic materials (e.g., polycarbonate). In thisexample, the elongated body portion may be off-centered (i.e., closer tothe lowest edge of the rounded portion), and the adhesive layer 118C onthe upper surface of the elongated body portion is thicker than theadhesive layer 118C on the lower surface. The adhesive layer 118C on theupper surface of the elongated body portion may include a cushion layerdescribed above while the adhesive layer 118C on the lower surface doesnot.

In the exemplary configurations depicted in FIGS. 5A-5C, the supportlayer 108 on the upper side of the support member 116 is extended outtoward the bend allowance section further than the encapsulation 104. Inother words, some of the support layer 108 near the edge of the flexibledisplay 100 is not overlapped by the encapsulation 104. The extra margin(denoted “A”) of the support layer 108 provided under the encapsulation104 can help maintain a steady rate of curvature in the bend allowancesection.

When bending the base layer 106 around the rounded end portion of thesupport member 116, the support layer 108 can be positioned on therounded end portion of the support member 116 due to alignment error. Insuch cases, the support layer 108 on the rounded end portion may pushaway the elements on the base layer 106 and shift the neutral plane orcause delamination of those elements in the bend portion of the flexibledisplay 100. As such, the support layer 108 under the base layer 106 isarranged such that the edge of the support layer 108 is extended outtoward the bend allowance section further than the edge of theencapsulation 104. In other words, the support member 116 may be placedunder the support layer 108 with some margin (denoted “B”) between theedge of the support layer 108 and the tip of the support member 116.

Similar to the support layer 108 place above the support member 116, thesupport layer 108 under the support member 116 should not be placed onthe rounded end portion of the support member 116. However, the edge ofthe support layer 108 under the support member 116 needs not be alignedwith the edge of the support layer 108 above the support member 116.Considering that the base layer 106 will be wrapped around the roundedend portion of the support member 116, spacing between the separatedsupport layers 108 on the bottom surface of the base layer 106 can beset with some alignment error margin. As such, the support layer 108 tobe placed under the support member 116 may be arranged on the bottomsurface of the base layer 106 such that the edge of the lower sidesupport layer 108 is positioned further away from bend allowance sectionthan the edge of the support layer 108 above the support member 116. Inthis setting, the distance between the edge of the lower side supportlayer 108 and the lower tip of the rounded end portion of the supportmember 116 (denoted “C”) can be greater than the distance between theedge of the upper side support layer 108 and the upper tip of therounded end portion of the support member 116 (denoted “C”).

In some embodiments, the edge of the support layer 108 toward the bendallowance section can be provided with a flange 108F, which extends evenfurther out toward the bend allowance section as shown in FIG. 5A. Theflange may be formed by cutting or otherwise patterning the supportlayer 108 to have a tapered edge. The flange can also be provided bystacking at least two support layers with their edges shifted from eachother. While omitted in FIGS. 5B and 5C, the flange can be provided inthose embodiments as well.

It should be appreciated that the configurations described above inreference to FIGS. 5A-5C are merely illustrative. Adhesive layers 118having the same thickness can be provided on the upper and the lowersurfaces of the support member regardless of the position of theelongated body portion. Further, adhesive layers 118 on both the uppersurface and the lower surface of the support member 116 can include acushion layer.

Instead of employing a discrete support member 116, in some embodimentsof the flexible display 100, the support layer 108 may be provided witha thickened rounded end positioned under the base layer 106 in the bendallowance section. FIG. 5D is a schematic illustration showing anexemplary arrangement of the support layer 108 under the base layer 106at the bend portion of the flexible display 100. In this example, theend portion of the support layer 108 is thicker than the portion of thesupport layer 108 under the display area of the flexible display 100.Also, the thicker portion of the support layer 108 has a rounded edge,which substantially conforms to the curvature of the base layer 106 inthe bend allowance section. In this way, the rounded edge of the supportlayer 108 can serve as the support member 116 employed in theembodiments depicted in FIGS. 5A-5C.

As such, a portion of the support layer 108D corresponding to thesubstantially flat portion of the flexible display 100 or to the displayarea can have a different thickness from the portion of the supportlayer 108D corresponding to the bend portion of the flexible display100. It should be noted that the thickness of the support layer 108D maybe thicker in the bend portion of the flexible display 100 than thesubstantially flat portion of the flexible display 100 as the roundededge portion of the support layer 108D is used in providing the curvedsurface for the flexible base layer 106 to be wrapped around. Similar tothe support member 116 of the previously mentioned embodiments, thesupport layer 108D provided with the rounded edge portion can be formedin a desired color (e.g., black, white, etc.).

Unlike the embodiments employing two separate support layers 108 (e.g.,108A, 108B) at the opposite ends of the bend allowance section, a singlepiece of support layer 108D is used to support the base layer 106 in thebend portion of the flexible display 100. In addition to the costsavings and process simplification in manufacturing of the flexibledisplay 100, the elimination of a separate support member 116 from theflexible display 100 provides may provide various benefits as to thedesign of the flexible display 100. First of all, it is very unlikelythat the encapsulation 104 will be extended out toward the bendallowance section past the support layer 108D when using the end of thesupport layer 108D to support the base layer 106 in the bend allowancesection. Accordingly, any problems which might result from themisalignment of the encapsulation 104 in relation to the edge of thesupport layer 108 on the separate support member 116 can be prevented.

Also, using a single piece of support layer 108D for supporting the baselayer 106 in the bend portion eliminates the needs for providingalignment error margins between separate pieces of the elements in thebend allowance section. For instance, the extra margins for ensuringthat the support layers are not placed over the rounded end portion ofthe support member 116 (e.g., margins B and C) are no longer needed.With the extra margin reduced or eliminated from the design of the bendportion, even a narrower bezel can be achieved in the flexible display100.

The support layer 108D may be formed of any of the plastic materialsdescribed suitable for the support layer 108 and the support member 116.For example, the support layer 108D can be formed of plastic materialsuch as polycarbonate (PC), polyimide (PI), polyethylene naphthalate(PEN), polyethylene terephthalate (PET), other suitable polymers, acombination of these polymers, etc. The rigidity of the support layer108D formed of such plastic materials may be controlled by the thicknessof the support layer 108D and/or by providing additives for increasingthe rigidity. However, to provide the thicker rounded end portion in thesupport layer 108D as shown in FIG. 5D, it is preferred that the supportlayer 108D is formed of a material suitable for an injection moldingprocess or other processes capable of forming the support layer 108Dwith an edge that is sufficiently rounded to accommodate the curvatureof the base layer 106 in the bend allowance section.

Conductive Lines

Several conductive lines are included in the flexible display 100 forelectrical interconnections between various components therein. Thecircuits fabricated in the display area and non-display area maytransmit various signals via one or more conductive lines to provide anumber of functionalities in the flexible display 100. As brieflydiscussed, some conductive lines may be used to provide interconnectionsbetween the circuits and/or other components in the central portion andthe bend portion of the flexible display 100.

As used herein, the term conductive lines broadly refers to a trace ofconductive path for transmitting any type of electrical signals, powerand/or voltages from one point to another point in the flexible display100. As such, conductive lines may include source/drain electrodes ofthe TFTs as well as the gate lines/data lines used in transmittingsignals from some of the display driving circuits (e.g., gate driver,data driver) in the non-display area to the pixel circuits in thedisplay area. Likewise, some conductive lines, such as the touch sensorelectrodes, pressure sensor electrodes and/or fingerprint sensorelectrodes may provide signals for sensing touch input or recognizingfingerprints on the flexible display 100. Furthermore, conductive linescan provide interconnections between elements of the display area in thecentral portion and elements of the secondary display area in the bendportion of the flexible display 100. It should be appreciated that thefunctionalities of conductive lines described above are merelyillustrative.

Conductive lines in a flexible display 100 should be carefully designedto meet various electrical and non-electrical requirements. Forinstance, a conductive line may have a specific minimum electricalresistance level, which may vary depending on the type of signals to betransmitted via the conductive line. Some conductive lines may be routedfrom the substantially flat portion to the bend portion of the flexibledisplay 100. Such conductive lines should exhibit sufficient flexibilityto maintain its mechanical and electrical robustness. To this end, someconductive lines of the flexible display 100 may have a multi-layeredstructure.

Accordingly, in some embodiments, at least some of the conductive lines120 of the flexible display 100 may be formed with two or more of layersselected from aluminum (Al), titanium (Ti), molybdenum (Mo), Copper (Cu)layers. Examples of such combination include an aluminum layersandwiched between titanium layers (Ti/Al/Ti), an aluminum layersandwiched between upper and lower molybdenum layers (Mo/Al/Mo), acopper layer sandwiched between titanium layers (Ti/Cu/Ti) and a copperlayer sandwiched between upper and lower molybdenum layers (Mo/Cu/Mo).Of course, other conductive materials can be used for theprimary/secondary conductive layers.

Manufacturing of the flexible display 100 can involve scribing a largeflexible polymer sheet into a base layer 106 of a desired shape andsize. Also, some parts of the base layer 106 may become unnecessary asthe manufacturing progresses, and such parts can be chamfered away fromthe base layer 106. Some conductive lines on the base layer 106 laidacross the scribing line and/or the chamfering line can be cut duringthe scribing and/or chamfering processes. For instance, one or moreconductive lines used for testing or temporarily operating the drivingcircuits, pixels and/or various other components during manufacturing ofthe flexible display 100 may be laid across the scribe line or thechamfering line of the base layer 106. Such conductive lines may bereferred to as the “test lines” in the present disclosure. Once thetests or other procedures involving the use of these test lines arecompleted, scribing and/or chamfering processes can be performed toremove the scribed/chamfered area along with the parts of the test linesplaced thereon.

In some embodiments, a pad for receiving one or more signals may beprovided on one end of the conductive lines. The other end of theconductive line may be connected to the data lines of the pixels and/orsome of the driving circuits. Various signals can be supplied on theconductive line via the pads and transmitted to the destination via theconductive line to carry out the test procedures. These test pads maytake a considerable space on the base layer 106, and thus they can beplaced on the part of the base layer 106 to be scribed/chamfered away.

FIG. 6A illustrates a non-display area of the flexible display 100, inwhich a bend allowance section is provided. For instance, theconfiguration shown in FIG. 6A may be used in area NA1 of FIG. 1A.Referring to FIG. 6A, the test lines 120_C and test pads 120_P can beplaced in the non-display area where the bend allowance section islocated. In particular, the test pads 120_P can be provided in the areathat is to be notched away by the chamfering process.

The non-display area with the bend allowance section may not havesufficient room to accommodate testing pads 120_P, especially ifconnection interfaces for connecting external printed circuit board areprovided in that non-display area. In such cases, the test line 120_Cmay be routed across the bend allowance section. Further, the test line120_C may be arranged to overlap other conductive lines provided in therouting area, and it can cause undesired parasitic capacitance issues.

Accordingly, in some other embodiments, the testing pads may be providedin the non-display area other than the ones provided with the connectioninterfaces for connecting printed circuit board (PCB). As shown in FIG.6B, the testing pads 120_P can simply be placed outside the chamferingline of the base layer 106 so that they are removed from the flexibledisplay 100 after the chamfering process.

Regardless of where the testing pads 120_P were placed, the part of thetest lines 120_C remaining on the base layer 106 will be extended untilthe scribed/chamfered edge of the base layer 106, and the exposedsurface of the test lines 120_T at the scribed/chamfered edge of thebase layer 106 can be highly susceptible to galvanic corrosion.

Electronic device employing the flexible display 100, for instance awearable electronic device or a water submergible electronic device, mayexpose the flexible display 100 in a humid environment. In some cases,moist can reach the conductive line 120. Dissimilar metals and alloyshave different electrode potentials, and when two or more come intocontact in an electrolyte, one metal acts as anode and the other ascathode. The electro-potential difference between the dissimilar metalsaccelerates corrosion on the anode member of the galvanic couple, whichwould be the primary conductive layer 122 in the multi-layeredconductive line 120 (e.g., Al layer in the Ti/Al/Ti stack). The anodemetal dissolves into the electrolyte, and deposit collects on thecathodic metal.

Corrosion at one point can grow along the conductive line and causevarious defects within the flexible display 100. In order to suppressthe growing of the corrosion, a bridge structure 120_B can be providedin the conductive line (e.g., the test lines 120_C), which is to be cutby the scribing or chamfering processes during manufacturing of theflexible display 100. More specifically, the conductive line 120_C caninclude at least two parts. The part of the conductive line extended tothe scribed/chamfered edge of the base layer 106 is separated apart fromthe rest of the conductive line remaining on the base layer 106. Theseseparated conductive line parts are connected by a conductive bridge120_B, which is arranged to be in contact with each of the separatedparts of the conductive line through contact holes in one or more theinsulation layer(s).

Before a part of the conductive line on the base layer 106 is cut by thescribing/chamfering processes, signals can be transmitted between theseparated conductive line parts via the conductive bridge 120_B. Afterthe part of the conductive line is cut by the scribing/chamferingprocess, the corrosion which may start from the scribed edge or thechamfered edge is suppressed from growing along the conductive line dueto the space between the separated conductive line parts. Although thebridge 120_B is in contact with the separated parts of the conductiveline, the bridge 120_B is located in a different layer from theconductive line 120_C, and it hinders the growth of corrosion past thebridge 120_B.

FIG. 7A illustrates a cross-sectional view of an exemplary embodiment offlexible display 100 provided with bridged conductive lines. In theembodiment shown in FIG. 7A, the separated conductive line parts areprovided in the same metal layer as the gate electrode of at least someof the TFTs provided on the base layer 106. Also, the bridge can beprovided in the same metal layer as the source/drain electrodes of theTFTs. The interlayer dielectric layer (ILD) between the source/drainelectrodes and the gate electrode of the TFTs may also be providedbetween the bridge 120_B and the separated conductive line parts 120_C,and the bridge 120_C can be in contact with the conductive line parts120_C via contact holes in the ILD.

The gate insulation (GI) layer provided between the gate electrode andthe semiconductor layer of the TFTs may also be provided under theseparated parts of the conductive line. Optionally, the buffer layer 126and the active buffer layer under the semiconductor layer of the TFTscan be provided under the conductive line parts 120_C. The passivationlayer 128 on the source/drain electrode of the TFTs can be provided overthe bridge 120_B as well. As will be described in further detail below,these insulation layers provided on or below the bridge 120_B and theconductive line parts 120_C can be patterned to suppress crackpropagation in the wire traces.

It should be noted that the semiconductor layer as well as some of theinsulation layers provided in the TFT area may not be provided in thearea where the bridged conductive line is placed. As such, although theseparated conductive line parts 120_C and the gate electrode of the TFTsare provided in the same metal layer, they need not be in the same planelevel as each other. In other words, the gate electrode of the TFTs andthe conductive line parts 120_C can be formed by deposition of the samemetal layer, but their plane level may be different by the structure ofthe layers under the metal layer. Likewise, the bridge 120_B forconnecting the separated conductive line parts 120_C and thesource/drain electrodes of the TFTs can be provided in the same metallayer, yet be in a different plane level from each other.

FIG. 7B is a cross-sectional view illustrating another exemplaryembodiment of the flexible display 100 provided with bridged conductivelines. In the embodiment depicted in FIG. 7B, the bridge 120_B isprovided under the separated conductive line parts 120_C. Morespecifically, the bridge 120_B is provided in the same metal layer asthe gate electrode of the TFTs in the flexible display 100, and theconductive line parts 120_C are provided in the same metal layer as thesource/drain electrodes of the TFT. In this case, each of the separatedconductive line parts 120_C will be in contact with the bridge 120_Bthrough the contact holes in the insulation layer between the conductiveline parts 120_C and the bridge 120_B positioned thereunder.

In the embodiments depicted in FIGS. 7A and 7B, the metal layers, inwhich the conductive line parts 120_C and the bridge 120_B are formedin, are described in reference to the metal layers used for providingelectrodes of co-planar type TFT. However, it should be noted that theflexible display 100 can include TFTs with staggered and/or invertedstaggered structures (i.e., top gated or bottom gated staggered TFTs).Accordingly, metal layers for implementing the separated conductive lineparts 102_C and the bridge 120_B may vary based on the stack structureof the TFTs in the flexible display 100. Also, various insulation layersother than the ILD, for instance gate insulation layer, passivationlayer, planarization layer and the likes, may be provided in between theseparated conductive line parts 120_C and the bridge 120_B based on thestructure of the TFTs.

Furthermore, it should be appreciated that the layer for implementingthe conductive line parts 120_C and the bridge 120_B are not limited tothe layers used for the gate electrode or the source/drain electrodes ofthe TFTs in the flexible display 100. Any conductive layers in theflexible display 100 may be used to provide the conductive line parts120_C and the bridge 120_B so long as there is at least one insulationlayer between the conductive line parts 120_C and the bridge 120_B. Forexample, any one of the conductive line parts 120_C and the bridge 120_Bmay be implemented with an inter-metal layer, which may be used is someof the TFTs in the flexible display 100. Also, a touch sensor may beintegrated in the flexible display 100, and the conductive layer forimplementing the touch sensor can be used in providing any one of theconductive line parts 120_C and the bridge 120_B in the flexible display100. In embodiments of the flexible display 100 using oxide TFTs, themetal oxide layer used for providing the active layer of the TFT can bepatterned as the conductive line parts 120_C or the bridge 120_B. Posttreatment can be performed on the metal oxide layer patterned as theconductive line parts 120_C or the bridge 120_B to obtain a desiredconductivity.

Trace Design

A trace design of a conductive line 120 is an important factor, whichcan affect the conductive line's electrical and mechanical properties.To meet the electrical and mechanical requirements, some portion of aconductive line 120 may be configured differently from another portionof the conductive line 120. As such, a portion of a conductive line ator near the bend allowance section of the flexible display 100 may beprovided with several features for bend stress management.

Bend stress management of the insulation layers near the conductive line120 is just as important as the managing the strain of the conductiveline itself. Various insulation layers, such as the buffer layer 126,the passivation layer 128, a gate insulation layer (GI layer) and aninterlayer dielectric layer (ILD layer) positioned below and/or abovethe conductive line 120 may include a layer of inorganic materials.Layers that are formed of inorganic material, for instance a siliconoxide layer and a silicon nitride layer, are generally more prone tocracks than the metal layers of the conductive line. Even when theconductive lines have a sufficient flexibility to cope with the bendstress without a crack, some of the cracks initiated from the insulationlayer can propagate into the conductive lines and create spots of poorelectrical contacts in the flexible display 100.

In addition to applying a trace design for reducing bend stress on aconductive line, some of the insulation layers above and/or below thelayer of conductive line may be patterned according to the trace designof the conductive line to minimize the chance of cracks. Variousinsulation layer patterning methods, such as wet etching and/or dryetching processes, can be used to form a trace of insulation layer thatcorresponds to the trace of a conductive line. Lack of insulation layer,especially the inorganic material based insulation layer around thetrace of a conductive line not only lowers the chance of crackgeneration, but it also cuts off the path for a crack propagation. Forconvenience of explanation, a trace of conductive line 120 and a traceof insulation layers covering at least some part of the conductive line120 are collectively referred to as the “wire trace” in the followingdescription.

Strain on a wire trace from the bend stress will be greater as thedirection in which the wire trace extends is more aligned with thetangent vector of the curvature. In other words, a wire trace willwithstand better against the bend stress if the length of a wire tracesegment being parallel to the tangent vector of the curvature isreduced. No matter which direction the wire trace is extended to, therewill always be a portion in the wire trace that is measurable in thebending direction. However, a length for each continuous measurableportion (i.e., a segment) being aligned parallel to the bendingdirection can be reduced by employing a strain-reducing trace design inthe wire trace.

FIG. 8A illustrates an exemplary strain-reducing trace designs. A wiretrace may employ a trace design in which the wire trace repeatedlysplits and converges back in a certain interval. In other words, a wiretrace includes at least two sub-traces arranged to form a trace designresembling a chain with a series of connected links. The angles of splitand merge define the shape of each link, which allows to limit thelength of the wire trace segment measurable in straight line parallel tothe bending direction.

Referring to FIG. 8A, the conductive line 120 includes sub-trace A andsub-trace B, which are split away from each other and merge back at eachjoint X. Between the first joint X(1) and the second joint X(2), a partof the sub-trace A is extended for a predetermined distance in a firstdirection angled away from the tangent vector of the curvature, andanother part of the sub-trace A is extended in a second direction. Thesub-trace B is arranged in a similar manner as the sub-trace A, but in amirrored orientation in reference to the tangent vector of thecurvature. The distances and directions in which the sub-traces arearranged between the two adjacent joints X define the shape and the sizeof the link in the chain as well as the open area surrounded by thesub-traces. In this example, the shape of the conductive line 120between the joint X(1) and X(2) (i.e., link) has a diamond shape with anopen area surrounded by the sub-trace A and the sub-trace B. Withadditional joints X, the conductive line 120 forms a chain of diamondshaped links, and thus the trace design may be referred to as thediamond trace design. Employing such a strain-reducing trace designincreases the portion of the wire trace arranged in a slantedorientation with respect to the tangent vector of the curvature. This,in turn, limits the length of the wire trace segment extending in astraight line parallel to the bending direction.

The strain-reducing trace design shown in FIG. 8A can providesignificant advantages in terms of electrical property. For instance,the wire trace provided with the split/merge trace design can providemuch lower electrical resistance than the wire traces employingnon-split strain-reducing trace designs such as the sign-wave or theserpentine trace designs. In addition, sub-traces can serve as a backupelectrical pathway in case one of the sub-traces is damaged or severedby cracks.

Since the cracks in the wire trace by bending of the flexible displaygenerally initiate from an inorganic insulation layer, it is imperativethat the length of the insulation layer trace being aligned with thetangent vector of the curvature is also minimized. Accordingly, theinsulation layers covering the surfaces of the conductive line 120 mayalso be patterned in a trace design corresponding to the trace design ofthe conductive line 120. For example, the insulation layer under theconductive line 120 can be etched away. The insulation layer under theconductive line 120 may be the buffer layer 126, which may include oneor more layers of inorganic material layers. The buffer layer 126 may beformed of one or more layers of a SiN_(x) layer and a SiO₂ layer. In onesuitable configuration, the buffer layer 126 may be formed ofalternating stacks of a SiN_(x) layer and a SiO₂ layer. The buffer layer126 is disposed on the base layer 126, but under the TFT.

In the substantially flat portion of the flexible display 100,additional layer of inorganic layer may be provided immediately belowthe semiconductor layer of the TFT, which may be referred to as theactive buffer. In some embodiments, an inorganic layer, which is mostclosely positioned under the active layer of the TFT, may be muchthicker than the individual inorganic layers of the buffer layer 126.

The buffer layer 126 in the bend allowance section may be etched evenfurther to expose the base layer 106 while leaving the buffer layer 126intact under the conductive line 120. In other words, a recessed areaand a protruded area are provided in the bend portion of the flexibledisplay 100. The protruded area includes the buffer layer 126 providedon the base layer 106, whereas the recessed area has the base layer 106exposed without the buffer layer 126 disposed thereon.

As such, the open area surrounded by the sub-trace A and the sub-trace Bis free of the inorganic insulation layer(s), or has thinner inorganicinsulation layer(s) than the areas under and/or above the trace ofconductive line 120. As such, the length of the insulation layer tracemeasurable in straight line parallel to the bending direction can belimited to reduce the chance of crack initiation and propagation.

Various additional factors must be considered for the strain-reducingtrace designs based on a plurality of sub-traces. The split/merge anglesand the length of each sub-traces between two adjacent joints X shouldprovide an offset for the inorganic insulation layer at the joints X andat the outer corners where the sub-trace changes its direction betweentwo adjacent joints X. To put it in another way, the open area, which issurrounded by the split sub-traces between two joints X of the wiretrace, should have a size and a shape to minimize the length in which aninorganic insulation layer trace of the wire trace extending parallel tothe bending direction.

In the diamond trace design depicted in FIG. 8A, the buffer layer 126and the passivation layer 128 covering the trace of the conductive line120 are patterned with a predetermined margin from the outer trace(i.e., outer edge) of the conductive line 120. Other than the insulationlayers with the predetermined margin remaining to cover the conductiveline 120, the open area surrounded by the sub-traces A and B, which isdenoted as FA2, is free of the insulation layers. As such, a trace ofinsulation layers is formed in accordance with the trace design of theconductive line 120. The length of the open area without the insulationlayers measured in orthogonal direction from the bending direction isgreater than the width of the inorganic insulation layer trace at thejoint X measured in the same direction. In this setting, the open areaFA2 surrounded by the sub-traces A and B as well as the area next to thejoint X can be free of the inorganic insulation layers, or otherwiseprovided with a reduced number of inorganic insulation layers.

The insulation layer free area FA1 prohibits the insulation layer of thesub-trace A and the sub-trace B between the two joints X(1) and X(2) tobe extended in a continuous straight line. Similarly, the insulationlayer free area FA2 prohibits the insulation layer between the twojoints X(1) and X(2) to be extended in a continuous straight line.Accordingly, the length of each segment of the insulation layer tracebeing aligned to the tangent vector of the curvature is minimized.

Further reduction in the length of the insulation layer trace aligned tothe tangent vector of the curvature can be obtained by reducing thewidth of the conductive line 120 and the margin of the insulation layerbeyond the edge of conductive line 120. It should be noted that the lowelectrical resistance offered by the trace designs of the presentdisclosure provide greater freedom in reducing the width of conductiveline 120.

The strain-reducing trace design illustrated in FIG. 8A is merelyexemplary, and other trace designs for reducing the length of a wiretrace segment parallel to the bending direction may be used in variousembodiments of the flexible display 100. Further, it should be notedthat some wire traces may adopt different strain-reducing trace designfrom other wire traces in a flexible display 100 depending on theirelectrical and/or mechanical requirements. For instance, astrain-reducing trace design used for a data signal line may bedifferent from a strain-reducing trace design used for a power line.

Even with the strain-reducing trace design, the inevitable bend stressremains at certain points of the trace (i.e., stress point). Thelocation of stress point is largely dependent on the shape of the traceas well as the bending direction. It follows that, for a given bendingdirection, the wire trace can be designed such that the remaining bendstress would concentrate at the desired parts of the wire trace. Knowingthe location of the stress point in the wire trace, a crack resistancearea can be provided to the stress point to make the wire trace lastlonger against the bend stress.

When a wire trace having the diamond trace design is bent in the bendingdirection, the bend stress tends to focus at the angled corners (i.e.,the vertexes of each diamond shaped link), which are denoted as thestress point A and stress point B. As such, cracks tend to initiate andgrow between the inner and outer edges of the wire trace. For instance,at the stress points A, a crack may initiate from the inner trace line120(IN) and grow toward the outer trace line 120(OUT). Similarly, acrack may initiate from the outer wire trace line 120(OUT) and growtoward the inner trace line 120(IN) at the stress points B.

Accordingly, the width of the conductive line 120 at the stress points Acan be selectively increased to serve as the crack resistance area. Asdepicted in FIG. 8A, the widths (W_(A), W_(B)) of the conductive line120 at the stress points A and B, which are measured in the directionperpendicular to the bending direction, may be longer than the width (W)of the conductive line 120 at the parts between the stress points A andB. The extra width at the stress points can make the conductive line 120hold out longer before a complete severance in the conductive line 120occurs by the growth of a crack at the stress points.

It should be reminded that the length for the continuous portion of theinsulation layer trace being aligned to the bending direction should bekept minimal. Increasing the width of the conductive line 120 at thestress points A and B may necessitate increase in the width of theinsulation layer trace at the respective area, which results inlengthening the insulation layer trace being aligned parallel to thebending direction.

Accordingly, in some embodiments, the width of the conductive line 120measured in the direction perpendicular to the tangent vector of thecurvature at the stress points A ranges from about 2.5 um to about 8 um,more preferably, from about 3.5 um to about 6 um, more preferably fromabout 4.5 um to about 8.5 um, and more preferably at about 4.0 um. Thewidth of the conductive line 120 at the stress points B should also bemaintained in the similar manner as the width of the conductive line 120at the stress points A. As such, the width of the conductive line 120 atthe stress points B may range from about 2.5 um to about 8 um, morepreferably, from about 3.5 um to about 6 um, more preferably from about4.5 um to about 8.5 um, and more preferably at about 4.0 um. Since thesub-trace A and the sub-trace B merges at the stress point B, the widthof the conductive line 120 at the stress points B may be longer thanwidth at the stress points A.

In some embodiments, one of the inner trace line 120(IN) and the outertrace line 120(OUT) may not be as sharply angled as the other trace lineat the stress points A to minimize the chance of crack initiating fromboth sides. In the embodiment depicted in FIG. 8A, the inner trace line120(IN) is more sharply angled than the outer trace line 120(OUT) at thestress points A. However, in some other embodiments, the outer traceline 120(OUT) may be more sharply angled than the inner trace line120(IN) at the stress points A. In both cases, the less sharply angledtrace line can simply be more rounded rather than being a straight lineas the outer trace line 120(OUT) depicted in FIG. 8A. Further, both theinner trace line 120(IN) and the outer trace line 120(OUT) at the stresspoints A can be rounded.

The wire trace may split into additional number of sub-traces, resultingseries of links arranged in a grid-like configuration. As an example, awire trace can be configured as a web of diamond trace shapes asillustrated in FIG. 8B. Such a trace design is particularly useful for awire trace that transmit a common signal to multiple points or for awire trace that require a very low electrical resistance. For example, aVSS line and a VDD line in the flexible display 100 may have thegrid-like trace design, especially if such lines are arranged to crossover a bend allowance section. Neither the number of sub-traces nor theshapes of the sub-traces of the grid-like trace design are particularlylimited as the exemplary design depicted in FIG. 8B.

In some embodiments, the grid width can be reduced or increased inbetween two ends within the flexible display 100. Also, the grid-likewire trace shown in FIG. 8B can converge back to form the diamond traceshown in FIG. 8A or into other trace designs. In some cases, the size ofeach diamond-shaped trace of a grid-like wire trace may be larger thanthe size of each diamond-shaped trace of a diamond-chain trace to reducethe resistance.

Wire Trace Arrangement

Due to the portions angled away from the bending direction, a wire tracewith a strain-reducing trace design may necessitate a larger routingarea within the flexible display 100. In embodiments where a non-displayarea at the edge of the flexible display 100 is bent, the increase inthe routing area for accommodating the wire traces can actually increasethe size of the inactive area to be hidden under a masking.

Accordingly, wire traces applied with a strain-reducing trace design maybe arranged to facilitate tight spacing between adjacent wire traces.For instance, two adjacent wire traces with a strain-reducing tracedesign may each include a non-linear section, which would have a convexside and a concave side. The two adjacent wire traces can be arranged inthe flexible display such that the convex side of the non-linear sectionin the first wire trace is positioned next to the concave side thenon-linear section in the second wire trace. Since the spacing betweenthe two adjacent wire traces is limited by the shape and the size of thewire traces, the non-linear section in the strain-reducing trace designof the first wire trace may be larger than the non-linear section in thestrain-reducing trace design of the second wire trace. Of course, one ofthe first wire trace and the second wire trace may have a differentstrain-reducing trace design to better accommodate the non-linearsection of the other wire trace.

In some instances, two or more wire traces arranged next to each othermay each be applied with a strain-reducing trace design, and each of thewire traces may have a plurality of indented sections and distended. Insuch cases, the wire traces can be arranged such that the distendedsection of one of the wire traces to be positioned next to the indentedsections of the adjacent wire trace.

FIG. 8C illustrates an exemplary arrangement of multiple wire traces,each having the diamond trace design described above. The split of thesub-traces widens the layout of the wire trace to create the distendedsection, whereas merging of the sub-traces narrows the layout of thewire trace to create the indented section. Accordingly, in terms of itslayout, the indented section of the wire trace is at the joint X,whereas the distended section of the wire trace is at the point wherethe split/merge angles of the sub-traces change between two adjacentjoints X.

As shown in FIG. 8C, position of the joints X in a first wire trace andthe joints X in a second wire trace are arranged in a staggeredconfiguration. In this arrangement, the vertexes of the diamond shapedlink at the distended section in the first wire trace are positionednext to the joints X at the indented sections of the adjacent wiretraces. Such a staggered arrangement of the wire traces may help inlowering the electrical noises on the wire traces due to close proximitybetween the wire traces, and thus the distance between the wire tracescan be reduced. Even a tight spacing between the wire traces may bepossible by arranging the distended section of a wire trace to bepositioned closer toward the indented section of the adjacent wiretrace. For instance, the vertexes at the wide parts of one wire race canbe placed in the open area FA1, which is created by the split/mergeangle and the length of the sub-trace in the adjacent wire trace. Assuch, the staggered arrangement allows to maintain a certain minimaldistance between the wire traces while reducing the amount of spacetaken up by the wire traces.

Micro-Coating Layer

With the absent of various layers in the bend portion of the flexibledisplay 100, a protective layer may be needed for the wire traces,especially for the wire traces in the bend allowance section of theflexible display 100. Also, the wire traces in the bend portion can bevulnerable to moistures and other foreign materials as the inorganicinsulation layers can be etched away from in the bend portion of theflexible display 100. In particular, various pads and conductive linesfor testing the components during manufacturing of the flexible display100 may be chamfered, and this can leave the conductive lines extendedto the notched edge of the flexible display 100. Such conductive linescan be easily corroded by moistures, which can be expanded to nearbyconductive lines. Accordingly, a protective coating layer, which may bereferred to as a “micro-coating layer” can be provided over the wiretraces in the bend portion of the flexible display 100.

The micro-coating layer 132 may be coated over the bend allowancesection in a predetermined thickness to adjust the neutral plane of theflexible display 100 at the bend portion. More specifically, addedthickness of the micro-coating layer 132 at the bend portion of theflexible display 100 can shift the plane of the wire traces closer tothe neutral plane.

In some embodiments, the thickness of the micro-coating layer 132 in thearea between the encapsulation 104 and the printed circuit board 200,which is measured from the surface of the base layer 106, may besubstantially the same as the thickness of the encapsulation 104 on thebase layer 106 to the top surface of the encapsulation 104.

The micro-coating layer should have sufficient flexibility so that itcan be used in the bend portion of the flexible display 100. Further,the material of the micro-coating layer should be a curable materialwith low energy within a limited time so that the components under themicro-coating layer are not damaged during the curing process. Themicro-coating layer 132 may be formed of a photo-curable acrylic (e.g.,UV light, Visible light, UV LED) resin and coated over the desired areasof the flexible display 100. In order to suppress permeation of unwantedmoistures through the micro-coating layer, one or more getter materialmay be mixed in the micro-coating layer.

Various resin dispensing methods, such as slit coating, jetting and thelike, may be used to dispense the micro-coating layer 132 at thetargeted surface. In way of an example, the micro-coating layer 132 canbe dispensed by using a jetting valve. The dispensing rate from thejetting valve(s) may be adjusted during the coating process for accuratecontrol of the thickness and the spread size of the micro-coating layer132 at the targeted surface. Further, the number of jetting valves indispensing the micro-coating layer 132 over the desired area is notlimited, and it can vary to adjust the dispense time and the amount ofspread on the dispensed surface before the micro-coating layer 132 iscured.

FIG. 9A illustrates one suitable exemplary configuration of themicro-coating layer 132 in an embodiment of flexible display 100. Asmentioned, the micro-coating layer 132 can be coated in the area betweenthe encapsulation 104 and the printed circuit board 200 attached in theinactive area. Depending on the adhesive property of the micro-coatinglayer 132 and the amount of bend stress, however, the micro-coatinglayer 132 can be detached away from the encapsulation 104 and/or theprinted circuit board 200. Any open space between the micro-coatinglayer 132 and the encapsulation 104 or the printed circuit board 200 canbecome a defect site where moisture can permeate through.

Accordingly, in some embodiments, the micro-coating layer 132 can beoverflowed onto a part of the encapsulation 104 as shown in FIG. 9A.That is, the top surface of the encapsulation 104 at its edge can becoated with the micro-coating layer 132. The additional contact area onthe surface of the encapsulation 104 coated by the micro-coating layer132 suppresses the micro-coating layer 132 from fall apart from theencapsulation 104 by the bend stress. The enhanced sealing provided bythe micro-coating layer 132 at the edge of the encapsulation 104 canreduce corrosion of the wire traces at the bend portion of the flexibledisplay 100. Similarly, the micro-coating layer 132 can be overflowedonto at least some part of the printed circuit board 200 for improvedsealing by at the edge of the printed circuit board 200.

Referring to FIGS. 9B and 9C, the width of the area on the encapsulation104 coated with the micro-coating layer 134 is denoted as “Overflow_W1”,and the width of the area on the printed circuit board 200 coated withthe micro-coating layer 134 is denoted as “Overflow_W2.” The sizes ofthe micro-coating layer 134 overflowed areas on the encapsulation 104and the printed circuit board 200 are not particularly limited and mayvary depending on the adhesiveness of the micro-coating layer 132.

As shown in FIG. 9B, the flexible display 100 may include a portionwhere the micro-coating layer 132 on the encapsulation 104 is spacedapart from the edge of the polarization layer 110. In some embodiments,however, the flexible display 100 may include a portion where themicro-coating layer 132 on the encapsulation 104 is in contact with thepolarization layer 110 disposed on the encapsulation 104 as depicted inFIG. 9C.

The spreading dynamic of the micro-coating layer 132 on the dispensedsurface depends on the viscosity of the micro-coating layer 132 as wellas the surface energy where the micro-coating layer 132 is dispensed. Assuch, the micro-coating layer 132 overflowed into the encapsulation 104may reach the polarization layer 110. The micro-coating layer 132 incontact with the sidewall of the polarization layer 110 can help inholding the polarization layer 132 in place. However, the micro-coatinglayer 132 reaching the sidewall of the polarization layer 114 may climbover the sidewall of the polarization layer 110. Such sidewall wettingof the micro-coating layer 132 can create uneven edges over the surfaceof the polarization layer 132, which may cause various issues in placinganother layer thereon. Accordingly, the amount of the micro-coatinglayer 134 dispensed on the targeted surface can be adjusted to controlthe width of the micro-coating layer 134 on the encapsulation layer 114.Further, the micro-coating layer 132 may be dispensed such that onlysome of the selective areas of the polarization layer 110 are in contactwith the micro-coating layer 132.

In one suitable configuration, the micro-coating layer 132 may be incontact with the polarization layer 110 at the two opposite corners(denoted “POL_CT” in FIG. 9A) while the micro-coating layer 132 betweenthe two corners does not reach the edge of the polarization layer 110.The micro-coating layer 132 between the two opposite corners (POL_CT)only covers up to some part of the encapsulation 104. After the bendingprocess, the part of the flexible display 100 where the micro-coatinglayer 132 is spaced apart from the polarization layer 110 may beconfigured as shown in FIG. 10A. In the region where micro-coating layer132 is configured to be in contact with the polarization layer 110, theflexible display 100 may be configured as shown in FIG. 10B.

Divided VSS-VDD Wire Trace

Spreading dynamic of the micro-coating layer 132 over the wire tracescan be affected by the trace design of the wire traces. Morespecifically, patterning of the insulation layers along the wire tracein the bend portion of the flexible display 100 creates recessed areasand protruded areas, which essentially become a micro-grooved surface tobe covered by the micro-coating layer 132.

When applying the strain-reducing trace design in the wire traces,patterning of the insulation layers around the split sub-traces createsthe recessed open area, which is surrounded by the protruded stack ofwire traces. During coating of the micro-coating layer 132, some portionof the micro-coating layer droplet can permeate into the recessed openarea. It can hinder the spreading and reduce the maximum spreadingdiameter of the micro-coating layer 132 on such a micro-grooved surface,and result in some part of the bend portion being exposed without themicro-coating layer 132.

Decrease in the wettability of micro-coating layer 132 by thedistribution of the recessed areas and the protruded areas may bemagnified even more in the area over the wire trace applied with thegrid-like trace design shown in FIG. 8B. To counteract the viscid drag,in some embodiments, a wire trace, which includes multiple diamond-chaintraces adjoined side-by-side, can be provided with a rail between twoparts of the wire trace.

Referring to FIG. 11, a wire trace with a grid-like tracestrain-reducing trace design is provided with an elongated channelbetween divided grid-parts of the wire trace. Within the elongatedchannel, the conductive line 120 is not formed. Also, at least some ofthe inorganic insulation layers on the base layer 106 are removed in theelongated channel. The elongated channel between the grid-parts of thewire trace extends from the signal supplying side to the signalreceiving side of the wire trace. That is, the elongated channel may beextended in the direction parallel to the bending direction. It shouldbe noted that the separated parts of the wire trace on one side of theelongated channel is connected to the part of the wire trace on theopposite side of the elongated channel, and thus both parts of the wiretrace transmit the identical signal. The connection between the dividedparts of the wire trace may be achieved at one or both ends of the wiretrace by a conductive path, which may be a part of the wire trace. Theconnection of the divided parts of the wire trace may be achieved withinthe bend allowance section or outside the bend allowance section.

Even though the parts of the wire trace on each side of the elongatedchannel has the grid-like trace design, the reduced number ofdiamond-chain traces adjoined in each grid-part and the channel betweenthe grid-parts can reduce the viscid drag of the micro-coating layer132. More importantly, the elongated recessed channel between the partsof the wire trace serves as a path that improves the wettability of themicro-coating layer 132 over the wire trace. In sum, increase in themaximum spread diameter of the micro-coating layer 132 can be achievedby positioning one or more elongated channel within the wire having thegrid-like strain-reducing trace design.

It should be noted that the resistance of the wire trace can increasewith the elongated channel dividing the wire trace into multiplegrid-parts. Increase in the resistance of the wire can raise thetemperature of the wire trace when it is supplied with a signal.Accordingly, the number of elongated channels provided in a single wiretrace can depend on the signal transmitted via the wire trace. In somecases, the size of each diamond shaped link in a grid-like wire tracemay be larger than the size of diamond-shaped links in other wire tracesof the flexible display 100.

In one suitable configuration, one or more of power signal wires of theflexible display 100, such as the VDD and/or the VSS, has the grid-likewire trace formed of multiple diamond-chain traces adjoined side-by-sideas depicted in FIG. 11. The power signal wire trace includes one or moreelongated channels in its grid-like wire trace. Each of the elongatedchannels is provided between two divided grid parts, which are on theopposite sides of the elongated channel. The divided grid parts areconnected at one or both ends of the power signal wire. The size of thedivided grid parts may be substantially the same. That is, the number ofdiamond-chain traces forming a gird part on one side of the elongatedchannel may be the same as the number of diamond-chain traces forming agird part on the opposite side. If desired, however, the number ofdiamond-chain traces adjoined to each other to form one grid part maydiffer from the number of diamond-chain forming another grid part.

Printed Circuit Board

As mentioned, some components that cannot be placed directly on the baselayer 106 can be disposed on the printed circuit board 200. Conductivelines on the printed circuit board 200 transmits signals from and to thecomponents provided on the base layer 106 as well as the componentsdisposed on another printed circuit board. Referring to FIG. 12, on oneend of the printed circuit board 200, the conductive lines 220 arearranged to be in contact with the conductive lines 120 on the baselayer 106. The area where the part of the printed circuit board 200 andthe base layer 106 are attached together may be referred to as the“Flex-on-Panel (FOP) area.” In some embodiments of the flexible display,another printed circuit board may be attached to the printed circuitboard 200. In such cases, the area where the printed circuit boards areattached together may be referred to as the “flex-on-flex (FOF) area.”

In the FOP area, some parts of the conductive lines 220 can serve as theconnectors 222 (e.g., pads or pins), which is to be connected to thecorresponding connection interfaces on the base layer 106. In thecontact area, an anisotropic conductive adhesive (e.g., anisotropicconductive film: ACF) or other types of adhesives may be provided.Before bonding the printed circuit board 200 to the base layer 106,tests may be performed to inspect whether the conductive lines 220 onthe printed circuit board 200 are properly connected to the components(e.g., D-IC, Power Supply Unit) disposed thereon. However, the pitch ofthe conductive lines 220 may be very narrow in the FOP area, and thus itis difficult to supply/receive test signals on the conductive lines 220at such area. Therefore, the conductive lines 220 on the printed circuitboard 200 are routed beyond the FOP area to an area where they arearranged with a larger pitch and/or provided with test pads.

FIGS. 13A-13D each illustrates a cross-sectional view of an exemplaryconfiguration of a printed circuit board used in an embodiment of aflexible display 100. One or more components (Comp_A, Comp_B) can bedisposed on the printed circuit board 200, and the pins from thosecomponents may be connected to some of the conductive lines 220 of theprinted circuit board 220. Several other components can also be disposedon the printed circuit board 200. The Component 230 on the printedcircuit board 200 may receive image data from another component on theprinted circuit board 200 (e.g., from a processor, timing controller,etc.) and produce corresponding control signals for the flexible display100. Also, a power supply unit for converting the power from a powersource into various voltage levels used by the components of theflexible display 100. It should be noted that the components disposed onthe printed circuit board 200 are not limited to examples mentionedabove. In the figured, the components on the printed circuit board 200are disposed on the same side of the printed circuit board 200. However,it should be appreciated that components of the flexible display 100 canbe placed on both sides of the printed circuit board 200.

Patterns of conductive lines are formed on the printed circuit boardbetween the part with the Comp_A 230 and the part where those othercomponents (e.g., Comp_B 240) are placed. The Comp_A 230 may distributesignals to the display pixels or other components on the base layer 106via the conductive lines 220 provided on the side to be attached to thebase layer 106. In this regard, a contact area is provided in a part ofthe printed circuit board 200 so that exposed portion of the conductiveline 220 can be connected to the connection interface on the base layer106. The conductive lines 220 on the printed circuit board 200 can becovered by a layer of an insulating material (e.g., the solder resist:SR).

In some cases, the Comp_A 230 may be positioned between the contact areaand other components disposed on the printed circuit board 200, forinstance the Comp_B 240. Space for conductive line patterns on theprinted circuit board 200 can quickly run out with more componentsdisposed on the printed circuit board 200. The pattern of conductivelines 220 between the COMP_A 230 and the contact area may be simplerthan the pattern of conductive lines 220 between COMP_A 230 and othercomponents provided on the printed circuit board 200. For instance, theconductive line pattern forming data signal lines (source channelpattern) can be formed without crossing another line, but the conductiveline patterns for connection between the COMP_A 230 and other componentson the printed circuit board 200 may have to cross over anotherconductive line in the printed circuit board 200.

Accordingly, in some embodiments, the printed circuit board 200 may beprovided with multiple metal layers. Referring to FIG. 13A, at leastsome part of the printed circuit 200 is provided with multiple metallayers. In particular, the part of the printed circuit board 200 betweenthe contact area and the COMP_A 230 may be provided with a single metallayer (e.g., the first metal layer M1), whereas the part between theCOMP_A 230 other components on the printed circuit board 200 is providedwith a metal layer on both sides of a polymer layer 210. In this part ofthe printed circuit board 200, a first metal layer M1 is provided on oneside of a polymer layer 210 and another metal layer M2 is provided onthe opposite side of the polymer layer 210.

Accordingly, connection between some of the components in the part ofthe printed circuit board 200 with multiple metal layers may be madeusing the conductive lines 220 in both the first and second metal layers(M1, M2). With multiple metal layers in this part of the printed circuitboard 200, some of the conductive line patterns in one metal layer canbe arranged to cross over another conductive line patterns in anothermetal layer.

In the example shown in FIG. 13A, at least one of the conductive lines220 formed of the first metal layer M1 is in contact with at least oneconductive lines 220 formed of the second metal layer M2. As shown, thecontacts between the first metal layer M1 and the second metal layer M2can be made by a vertical conductive path (e.g., via hole) through thepolymer layer 210. The via hole through the printed circuit board 200may be formed by using a laser or a mechanical machining techniques. Thevia hole through the polymer layer 210 may be plated or filled withconductive material. Materials that may be used in providing theconductive path between the first and second metal layers includecopper, silver, gold, copper-tungsten, other suitable metals,carbon-based or organic conductors, or a combination of these materials.The use of a via hole discussed above is merely illustrative, andvarious other methods or structures may be used to electrically connectthe first metal layer M1 and the second metal layer M2.

FIG. 13B illustrates another example of printed circuit board 200provided with multiple metal layers. The printed circuit board 200 canbe susceptible to electrostatics, and the conductive lines 220 may bedamaged by the electrostatics. Accordingly, the conductive line 220formed with the second metal layer M2 may be a ground line, which isconfigured to discharge electrostatics from the printed circuit board200. Rather than providing a conductive line, a metal plate can beprovided in the second metal layer to discharge electrostatic from theprinted circuit board 200. Providing a ground line or a ground metalplate can be particularly useful if the width of the conductive lines220 on the printed circuit board are very narrow and/or if they arerouted with a very narrow pitch.

Similar to the test pads 120_P and the test lines 120_C described inreference to FIGS. 7A-7B, the part of the conductive lines 220 on theprinted circuit board 200 routed beyond the FOP area can be removed fromthe printed circuit board 200 when scribing/chamfering the printedcircuit board 200 into a desired shape and size. Thus, the conductivelines 220 remaining on the printed circuit board 200 can be routed untilthe scribed/chamfered edges of the printed circuit board 200. Forreliable connection between the connection interfaces, scribing of theprinted circuit board 200 is usually performed with a certain marginbetween the scribed edge and the contact area where the part of theconductive lines 220 serve as the connectors. The part of the conductivelines 220 routed outside the contact area toward the scribed edge, whichis sometimes referred to as the “valley” or the “valley pattern”, isalso susceptible to corrosion from the moisture and gasses passingthrough the micro-coating layer 132.

Accordingly, in some embodiments of the flexible display 100, at leastsome of the conductive lines 220 of the printed circuit board 200 may beconfigured as the bridged conductive lines 120 discussed above.Referring to FIG. 13C, two separate portions of a conductive line 220 inthe first metal layer M1 is connected to each other by a bridge 220_B inthe second metal layer M2. In particular, the exposed valley pattern ofthe conductive line 220 at the edge of the printed circuit board 200 isprovided in the first metal layer M1. Also, the contact area to beconnected to the connection interface on the base layer 106 and otherparts of the conductive line 220 connected to the pins of the COMP_A 230and/or to the pins of other components (e.g., power supply unit 240) areseparated from the valley of the conductive line 220. Electricalconnection between the valley pattern of the conductive line 220 andother separated conductive line parts is made through the bridge 220_Bprovided in the second metal layer M2. As discussed above, the contactbetween the first metal layer M1 and the second metal layer M2 can bemade through the via hole, which may be plated or filled with conductivematerial.

In this configuration, the bridge 220B allows to perform variouselectrical inspection on the conductive lines 220, and also protects thecontact area and other parts of the conductive line 220 from thecorrosion which may occur at the valley pattern afterscribing/chamfering the printed circuit board 200.

Referring to FIG. 13D, some part of a conductive line 220 can beprovided in the first metal layer M1 while some other part of theconductive line 220 is provided in the second metal layer M2. Thecontact area may be arranged to expose a part of the conductive line 220provided in the first metal layer M1 and a part of the conductive line220 in the second metal layer M2 may be exposed to provide test pads forinspection of the printed circuit board 200. The conductive lines in thefirst metal layer M1 and the second metal layer M2 are connected througha via hole. The conductive line 220 in the first metal layer M1 may beformed such that it is not extended to the scribed edge of the printedcircuit board 200. Also, the conductive line 220 in the first metallayer M1 may be covered by a layer of an insulating material (e.g., thesolder resist: SR) to protect the conductive line 220 from thecorrosion. Growth of corrosion from the valley pattern of the conductiveline 220 in the second metal layer 220 can be suppressed by the bridgedstructure as depicted in FIG. 13D.

The printed circuit board 200 of the flexible display 100 may employ yetanother feature that can help minimize corrosion of the conductive lines220. FIG. 14A is a plan view illustrating an exemplary configuration ofthe conductive lines 220 in the FOP area on the printed circuit 200. Asshown, certain conductive lines 220 disposed on the printed circuitboard 200 are arranged not to extend beyond the contact areas. That is,on the printed circuit board 200, some connectors are provided withvalley patterns while some of the selected connectors are providedwithout the valley patterns.

In case where there is another external component or other printedcircuit board to be connected to the printed circuit board 200, theconductive lines 220 that are routed between the FOP area and the FOFarea without being connected to the components on the printed circuitboard 200, such as the Drive-IC 230, may be the conductive lines 220that end at the contact area without the valley pattern. Such conductivelines (denoted “bypassing line” in FIG. 14A) are routed on the printedcircuit board 200 simply to provide interconnections between thecomponents on the base layer 106 and the components on another printedcircuit board, and thus, chances of defects in such conductive lines 220are very slim.

Without the valley pattern, the end of the conductive line 220 is notcut by the scribing process, and the outer layer (e.g., Sn layer) of theconductive line 220 can cover the inner layer (e.g., Cu layer) of theconductive line 220, which in turn suppresses corrosion. Also,eliminating the valley pattern of such bypassing conductive lines 220can increase the distance X between the valley patterns of otherconductive lines 220. Electrical flow between anodic metal and cathodemetal being one of the essential element for corrosion, increase in thedistance between the valley patterns can help reduce corrosion on thosevalley patterns. In addition, increasing the distance X between thevalley patterns can lower the chances of short between the conductivelines 220 caused by the corrosion debris and other deposits.

In some embodiments, a dummy connector may be provided between theconnectors that transmit signals of a voltage large difference from eachother. Referring to FIG. 14B, a dummy connector can be positionedbetween a connector for transmitting VGH and a connector fortransmitting VGL. Also, a dummy connector can be positioned between theVSS line connector and the VDD line connector. The VGH/VGL and VDD/VSSline connectors have the valley pattern extending to the scribed edge ofthe printed circuit board 200, whereas the dummy connectors do not havethe valley patterns. The space between the connectors of the oppositelycharged conductive lines 200 is increased by the width of the dummyconnector. The end of the dummy connector is spaced apart from thescribed edge of the printed circuit board 200. As such, corrosioncontrol on the valley patterns of the conductive lines with largevoltage difference can be realized.

In some cases, some of the signals, for instance the gate high/lowsignals and/or the power signals, may be transmitted by using a group ofseveral conductive lines 220 positioned next to each other on theprinted circuit board 200. Also, conductive lines 220 transmittingsimilar signals (e.g., clock signals) may be arranged next to each otheron the printed circuit board 200. In such cases, inspection on all ofthe conductive lines 220 of the same group may not be necessary.Accordingly, in some embodiments, at least one or more of connectors ina group of adjacently positioned connectors transmitting the same orsimilar type of signals may be provided on the printed circuit board 200without the valley pattern.

Referring to FIG. 14C, connectors for transmitting similar type ofsignals are provided adjacent to each other, which are denoted as“Connector Group.” Also, adjacently positioned connectors fortransmitting the same signal are denoted as “Multi-Pin Connector.” Asshown, at least one of the connectors among the multi-pin connector maybe formed on the printed circuit board 200 without the valley pattern.Similarly, at least one of the connectors among the group of connectorsthat provides similar signals may not be provided with the valleypattern. For instance, any one of the conductive lines CLK1, CLK2 andCLK3 may end with a connector without the valley pattern. This way,distance X between the remaining valleys can be increased, which canhelp reduce corrosion on those valley patterns. Further, chances ofshort between the valley patterns by the corrosion debris and otherdeposits can be reduced by increasing the distance X between the valleypatterns.

In some embodiments, the connector without the valley pattern may be thefirst and/or the last connector among the group of connectors. In FIG.14C, the connector B, which is positioned next to the connector group orthe multi-pin connectors, may be configured to transmit a different typeof signal from the signals transmitted on the connector group and themulti-pin connectors. By way of example, the connectors in the connectorgroup may be configured to transmit clock signals and the connector Bmay be configured to transmit any one of the VGH, VGL, VDD and VSSsignals. Among the connectors included in connector group and themulti-pin connectors, one that is positioned immediately adjacent to theconnector B may be provided on the printed circuit board 200 without thevalley pattern.

Furthermore, in some embodiments, solder resist (SR) covering theconductive lines outside the contact area may also be provided over thevalley patterns along the scribed edge as depicted in FIG. 14D. In thisregard, the solder resist (SR) may be coated over the valley patternsprior to scribing the printed circuit board 200. Alternatively, thesolder resist (SR) may be coated over the valley patterns after thescribing of the printed circuit board 200 is performed. In the lattercase, the solder resist (SR) may cover the exposed cross-sectional sidesurface of the valley pattern. While the configurations of connectorsare described in reference to the connectors in FOP area, suchconfigurations can also be used for the connectors in the FOF area.

These various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination. Theforegoing is merely illustrative of the principles of this invention andvarious modifications can be made by those skilled in the art withoutdeparting from the scope of the invention.

What is claimed is:
 1. An apparatus comprising: a panel having a firstarea, a second area and a bend allowance section between the first areaand the second area; an edge structure, at the bend allowance section,that allows easier bending of the panel when compared to a panel thatlacks the edge structure; at least one driver integrated circuit (D-IC)connected to the second area of the panel, wherein the bend allowancesection of the panel is bent such that the second area of the paneloverlaps at least some part of the first area of the panel and the firstarea and the second area have less curvature than that of the bendallowance section; and a printed circuit board coupled to the secondarea of the panel.
 2. The apparatus of claim 1, wherein the edgestructure has a rounded shape.
 3. The apparatus of claim 1, wherein theedge structure at the bend allowance section is extended to the firstarea.
 4. The apparatus of claim 1, further comprising a micro coatinglayer on the edge structure.
 5. A display apparatus, comprising: a baselayer defined with a first area, a second area and a bend allowancesection between the first area and the second area; a plurality ofdisplay pixels on the first area of the base layer; at least one driverintegrated circuit (D-IC) connected to the second area of the baselayer, wherein the bend allowance section of the base layer is bent suchthat the second area of the base layer overlaps at least some part ofthe first area of the base layer; and the base layer includes at leastone chamfered edge portion and the first area and the second area haveless curvature than that of the bend allowance section.
 6. The displayapparatus of claim 5, wherein the chamfered edge portion in the firstarea of the base layer has a rounded shape.
 7. The display apparatus ofclaim 5, wherein the chamfered edge portion in the bend allowancesection of the base layer has a rounded shape.
 8. The display apparatusof claim 5, wherein the bend allowance section of the base layer has anotch.
 9. The display apparatus of claim 5 wherein a width of the baselayer in the bend allowance section is shorter than a width of the baselayer in the first area and a width of the base layer in the second areais shorter than the width of the base layer in the first area.
 10. Adisplay apparatus, comprising: a base layer defined as a flat portionand a bend portion having a bend allowance section; a plurality ofdisplay pixels on the flat portion of the base layer; at least onedriver integrated circuit (D-IC) connected to an area of the base layerbehind of the bend allowance section of the base layer, and wherein thearea of the base layer have less curvature than that of the bendallowance section, and the base layer includes at least one chamferededge portion in the bend portion.
 11. The display apparatus of claim 10,wherein the chamfered edge portion includes at least two differentangles with respect to a bend line oriented horizontally.
 12. Thedisplay apparatus of claim 10, wherein the chamfered edge portion has arounded shape.
 13. The display apparatus of claim 12, wherein therounded shape is extended to the bend allowance section in the bendportion.
 14. The display apparatus of claim 10, wherein a width of thebase layer at a bend line oriented horizontally is wider than a width ofthe base layer at a bend allowance section.
 15. The display apparatus ofclaim 10, wherein a width of the base layer decreases from a bend lineoriented horizontally to a bend allowance section.
 16. The displayapparatus of claim 10, wherein the chamfered edge portion is on at leastone corner of the base layer and the bend portion is on at least oneside portion of the base layer.
 17. The display apparatus of claim 10,further comprising: a plurality of conductive lines in the bendallowance section of the base layer, the plurality of conductive linesin the bend allowance section being routed from the D-IC to one or moreconductive lines in the flat portion of the base layer; and a microcoating layer on at least a portion of the bend portion.
 18. The displayapparatus of claim 10, wherein the D-IC is directly on the base layerand the base layer is a flexible layer.
 19. The display apparatus ofclaim 10, further comprising a printed circuit board coupled to aconnection interface provided in the bend portion of the base layer,wherein a touch sensor driver integrated circuit is on the printedcircuit board.